Open student theses
In order to make use out of integrated circuits a sufficient packaging is needed. Especially for RF ICs the
packaging is a crucial and challenging part of the overall design process. and system integration. While going up in frequency to achieve a higher data rate, sufficient RF packaging becoming more difficult and expensive. This thesis is about the investigation and design of possible RF packaging approaches for the WR 3.4 waveguide band (220-330 GHz). The packaging is done using the IGM thin film technology. Especially the transition between chip and carrier substrate and from substrate to waveguide have to be investigated.
Relevant Experience:
- Basic understanding of RF engineering
- Basic understandig of thinfilm technology
- Expirience in Keysight ADS, Rfpro and Empro and CST are advantages
Contact:
For most applications accurately predicting transistor behavior is essential to ensure the circuit functions as intended. Precise modeling is crucial for designing schematics and layouts that perform reliable after fabrication, as it allows engineers to anticipate the actual behavior of the devices and minimize the risk of performance deviations. One issue of newest technologies is the lack of precise models for active devices. The Advanced Spice Model (ASM) provides a solid base for this, offering the flexibility needed to adjust the specific behavior of GaN transistors. In this thesis the ASM model will be adapted to measured performance of the transistors to improve the representation across all operating regions.
Type of Thesis:
BA ✅ FA ✅ MA ✅
Relevant Experience:
- Knowledge of semiconductor technologies
- Basic knowledge of microwave circuits
- Experience in Keysight ADS is advantageous
Contact:
Substrate-integrated waveguides (SIW) present a promising solution by combining the advantages of planar transmission lines with the high efficiency of rectangular waveguides. Therefore, SIW structures provide an attractive option for hetero-integration of various system components. The transition from rectangular waveguides to SIW is crucial for low-loss and broadband signal transmission, especially in frequency ranges extending into the sub-THz domain. The goal of this thesis is to develop and optimize a broadband transition from a rectangular waveguide to a substrate-integrated waveguide.
Type of Thesis:
BA ✅ FA ✅ MA ✅
Relevant Experience:
- Knowledge of RF engineering
- Knowledge of electroagnetic fields
- Experience with CST or Rfpro are advantageous
Contact:
Contact
Dominik Koch
M.Sc.Group Leader Power Electronics / Research Assistant
Benjamin Schoch
M.Sc.Group Leader High Frequency Electronics / Research Assistant