Open student thesis
Sensing is a major part of smart objects and equipment, for example, condition monitoring for predictive maintenance, which enables context awareness and production performance improvement, and results in a drastic decrease in downtime due to preventive maintenance.
In the framework of this thesis, an AI data framework monitoring framework is to be implemented using the FP-AI-MONITOR2 framework from STMicroelectronics. The software needs to be adapted to our own microcontroller board and sensor nodes.
Tasks & Goals
- familiarization & literature search
- analysis of the FP-AI-MONITOR2 and AI related software
- adaptation of the microcontroller source code for a custom board
- scientific verification & validation of the design
- written thesis & presentation
- Power Electronics I/II lecture or similar
- Knowledge of ARM microcontroller programming in C helpful
- Strong interest in AI
As in many technological areas, the aim in power electronics is to make components smaller, lighter and at the same time more powerful. 3-dimensional circuit carriers such as MID's (Molded Interconnect Devices) have many advantages in this respect. On the one hand they have the potential for further system miniaturization and function integration. On the other hand, the variety of parts in a system can be reduced and heat dissipation can be individually optimized. In addition to thermoplastic-based MIDs, thermoset and ceramic substrate materials have recently been developed and are of interest for power electronics. With smaller power modules and higher power density, however, the demands on packaging and interconnection technology (AVT) are also increasing. Thermal performance is an important criterion for material selection and AVT. The calculation of the transient temperature behavior of the semiconductors for a given power loss profile can be determined e.g. by Zth-curves.
In the context of this work, WBG power semiconductors on novel three-dimensional substrates are to be measured transiently thermally. A part of the work is the conception, design, construction and assembly of test samples with modern AVT-technologies like soldering, silver-sintering or semi-sintering.
The student work is supervised in cooperation between Hahn-Schickard and the ILH.
- Structure of test specimens
- Implementation of Zth-examinations
- Evaluation and summary of the results
- Documentation of the work
In the evolving electric vehicle market there is a need for high efficient and reliable power electronics. While Silicon existed in the market for several decades and sophisticated life time models like LESIT or CIPS08 were developed for those components such knowledge is still lacking limited applicable for SiC due to the different technology and physics. In this overall project a 3-phase inverter should be developed which provides close to application stresses. Sensor systems and highly accelerated tests as well as safety measurements should be developed. A focus on subtask is pursued and will be discussed with the tutor prior of the work.