From Nov. 7 to Nov. 9 the IEEE Workshop on Wide Bandgap Power Devices & Applications (WiPDA) took place in Redondo Beach, USA. Besides meeting new & old colleagues and discussing recent developments in SiC and GaN technologies and applications, our colleague Dominik Koch presented his paper "Comparison of Thermally Optimized SMD Packages for 100 V GaN HEMTs in 300 KHz Buck Converter High Current Applications" based on experiments carried out in the frame of the ECPE msPEBB project.
Credits to our colleague Stefan Moench from Fraunhfer IAF for the nice picture!