This week the 35th IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD 2023) took place in Hong Kong.
The ILH was represented by Dominik Koch, who contributed to the conference programme with a talk about the paper "Application-Oriented Characterization of Thermally Optimized, Asymmetrical Single Chip Packages for 100 V GaN HEMTs", whiche are results of the ECPE Project "Packaging Technology of GaN LV msPEBB Phase 2".
It was a pleasure to present the publication, see old colleagues and friends and meet new ones!
