Herr Prof. Dr.-Ing.

Ingmar Kallfass

Direktor und Institutsleiter
Institut für Robuste Leistungshalbleitersysteme

Kontakt

+49 711 685 - 68747
+49 711 685 - 58747

Visitenkarte (VCF)

Pfaffenwaldring 47
70569 Stuttgart
Deutschland
Raum: 1.173

  1. I. Dan, G. Ducournau, S. Hisatake, P. Szriftgiser, R. Braun, and I. Kallfass, “A Terahertz Wireless Communication Link Using a Superheterodyne Approach,” IEEE Transactions on Terahertz Science and Technology, vol. 10, no. 1, Art. no. 1, 2020, doi: 10.1109/TTHZ.2019.2953647.
  2. U. M. M.T. Koller L. Loidold, “The exploratory in-orbit verification of an E-band link (EIVE) cubesat project,” 10th Nano Satellite Symposium, Istanbul, 2020.
  3. L. Yan I. Kallfass, “A General Model Translation Approach for Vertical Power MOSFETs Based on BSIM3 Model,” in Proc. 11th International Conference on Integrated Power Electronics Systems, CIPS, Berlin, 2020.
  4. J. H. K. Sharma K. Muñoz Barón, “Characterization of the Junction Temperature of SiC Power Devices via Quasi-Threshold Voltage as Temperature Sensitive Electrical Parameter,” in Proc. 11th International Conference on Integrated Power Electronics Systems, CIPS, Berlin, 2020.
  5. M. Basler, S. Reiner R. Moench, P. Waltereit, R. Quay, I. Kallfass, and O. Ambacher, “Large-Area Lateral AlGaN/GaN-on-Si Field-Effect Rectifier with 0.2 V Turn-On Voltage,” IEEE Electron Device Letters, 2020.
  6. J. R. K. Sharma K. Muñoz Barón, “Characterization of Online Junction Temperature using Quasi-Threshold Voltage for SiC and GaN Power Transistors,” in. Proc. PCIM Europe, Nuremberg, Germany, 2020.
  7. J. Weimer I. Kallfass, “Thermal Study on Leadframe Dimensioning for High Power Dissipation and Low Inductance Commutation Cells,” in. Proc. PCIM Europe, Nuremberg, Germany, 2020.
  8. I. Dan et al., “300 GHz Wireless Link Employing a Photonic Transmitter and Active Electronic Receiver with a Transmission Bandwidth of 54 GHz,” IEEE Transactions on Terahertz Science and Technology, pp. 1–1, 2020, doi: 10.1109/TTHZ.2020.2977331.
  9. M. N. K. Muñoz Barón K. Sharma, “Threshold voltage instability under application-oriented power cycling conditions for SiC power devices,” in. Proc. PCIM Europe, Nuremberg, Germany, 2020.
  10. I. K. L. Manoliu B. Schoch, “FPGA Based Reconfigurable On-Board Payload Processing for an Exploratory In-Orbit Verification of an E-Band (71-76 GHz) Satellite Link (EIVE),” in Proc. 5th ESA SpacE FPGA Users Workshop, Noordwijk, 2020.
  11. R. R. M. Basler S. Moench, “A GaN-based Current Sense Amplifier for GaN HEMTs with Integrated Current Shunts,” in. Proc. 32nd IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2020.
  12. I. Kallfass, I. Dan, P. Szriftgiser, and G. Ducournau, “High Capacity Terahertz Communication Links Combining Photonic and Electronic Technologies in the Transmit-Receive Frontend,” in Proc. 9th International Workshop on Terahertz Technology and Applications, Kaiserslautern, 2020.
  13. A. L. B. Schoch A. Tessmann, “300 GHz broadband power amplifier with 508 GHz gain-bandwidth product and 8 dBm output power,” in Proc. IEEE Int. Microwave Symposium, Boston, 2019.
  14. A. L. C. Grötsch S. Wagner, “A Highly Linear FMCW Radar Chipset in H-Band with 50 GHz Bandwidth,” in Proc. IEEE Int. Microwave Symposium, Boston, 2019.
  15. A. Dyskin I. Kallfass, “Feasibility Study of the Feed-Forward Carrier Recovery Technique for E-band Integrated Receivers,” IET Circuits, Devices and Systems, pp. 1--9, 2019.
  16. I. K. U. Mohr B. Schoch, “Exploratory In-orbit Verification of a Wideband E/W-Band Data Downlink,” 12th Pico- and Nano-Satellite Workshop, Wuerzburg, Germany, 2019.
  17. B. S. I. Dan C. M. Groetsch, “A 300 GHz Quadtrature Down-Converter S-MMIC for Future Terahertz Communication,” in Proc. Conf. on Microwaves, Communications, Antennas and Electronic Systems (COMCAS), Tel Aviv, pp. 1--4, 2019.
  18. I. Kallfass, “300 GHz HEMT Transceivers and Comm/Imaging Applications,” Summer THz Array Radar Topology Workshop (START), Caltech, Pasadena, 2019.
  19. K. K. E.R. Bammidi A. Javed, “A Differential Traveling Wave Active Power Divider in 130 nm SiGe:BiCMOS Technology for Application in Receiver Synchronization,” in Proc. European Microwave Int. Circuits Conf. EuMIC, Paris, pp. 1--4, 2019.
  20. M. S. J. Acuna T. Rupp, “Influence of Power Cycle Turn-On Duration on the Lifetime of Power Module Die-Attach Layers,” in Proc. 25th Int. Workshop on Thermal Investigations of ICs and Systems (Therminic), Lecco, 2019.
  21. L. J. C.M. Groetsch S. Wagner, “A Dual Gate Downconverter for H-Band Employing An Active Load,” in Proc. Conf. on Microwaves, Communications, Antennas and Electronic Systems (COMCAS), Tel Aviv, pp. 1--4, 2019.
  22. I. K. C.M. Groetsch S. Wagner, “An Active Gate Pumped Frequency Upconverter for Terahertz Frequencies,” in Proc. German Microwave Conference (GeMIC), Stuttgart, pp. 1--4, 2019.
  23. P. W. S. Mönch R. Reiner, “Asymmetrical Substrate-Biasing Effects and 350 V Operation of Symmetrical Monolithic Normally-Off GaN-on-Si Half-Bridges,” in Proc. 7th IEEE Workshop on Wide Bandgap Power Devices and Applications, pp. 1--6, 2019.
  24. I. K. I. Dan .., “A Superheterodyne 300 GHz Wireless Link for Ultra-Fast Terahertz Communication Systems,” in Proc. IEEE Int. Microwave Symposium, Boston, 2019.
  25. I. K. D. Koch S. Araujo, “Accuracy Analysis of Calorimetric Loss Measurement for Benchmarking Wide Bandgap Power Transistors under Soft-Switching Operation,” in Proc. IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA-Asia), 2019.
  26. I. K. J. Winkler J. Homoth, “Novel Approach for Temperature and Current Sensing for Wide Bandgap Materials,” in Proc. Strategic Materials Conference (SMC), Munich, 2019.
  27. P. W. S. Moench R. Reiner, “Integrated Current Sensing in GaN Power ICs,” in Proc. International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2019.
  28. H. B. J. Winkler J. Homoth, “Study on transient Light Emission of SiC Power MOSFETs regarding the Sensing of Source-Drain Currents in hard switched Power Electronic Applications,” in. Proc. PCIM Europe, Nuremberg, Germany, 2019.
  29. M. C. W. Johannes S. Stanko, “Investigation of a new Bistatic FMCW-Receiver at 94 GHz with Wireless Synchronization,” in Proc. German Microwave Conference (GeMIC), Stuttgart, pp. 1--4, 2019.
  30. P. Harati I. Kallfass, “Time Domain Characterization of Frequency Dividers,” IEEE Microwave and Wireless Components Letters, pp. 1--4, 2019.
  31. H. B. J. Winkler J. Homoth, “Study on Light Emission of p-n junctions in Silicon Carbide Power Semiconductors,” in. Proc. 31st IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2019.
  32. I. Kallfass, “Satellite Communication in E,W-Band - Motivation, Viability, Compatibility,” ITG Fachausschuss HF2 Funksysteme Oeffentliche Diskussionssitzung Trends und Entwicklungen in der Weltraumnutzung, 2019.
  33. R. R. M. Basler S. Moench, “A GaN-on-Si Based Logic, Driver and DC-DC Converter Circuit with Closed-Loop Peak Current-Mode Control,” in. Proc. PCIM Europe, Nuremberg, Germany, 2019.
  34. L. Yan I. Kallfass, “A General Model Translation Approach for Vertical Structure Power MOSFETs Based on BSIM3 Model,” in Proc. IEEE International Power Electronics and Application Conference and Exposition (PEAC), 2018.
  35. I. K. L. Yan, “A General Model Translation Approach for Vertical Structure Power MOSFETs Based on BSIM3 Model,” in Proc. (PEAK), 2018.
  36. R. S. I. Kallfass R. Henneberger, “Wideband Data Transmission in E-Band Between an Aircraft and a Ground Station,” in Proc. 9th Advanced Satellite Multimedia Systems Conference (ASMS) and 15th Signal Processing for Space Communications Workshop (SPSC), Berlin, 2018.
  37. A. Dyskin I. Kallfass, “Phase noise prediction for static frequency dividers and ring oscillators,” Electronics Letters, pp. 1--2, 2018.
  38. A. L. D. Mueller J. Schaefer, “A High-Efficiency Broadband WR3 Bond Wire On-Chip Antenna,” in Proc. European Conf. on Antennas and Propagation (EuCAP), London, pp. 1--4, 2018.
  39. L. Manoliu C. Groetsch. I. Kallfass, “Design and Optimization of Mixers Using Load-Pull Analysis of Higher Order Intermodulation Products,” in Proc. Int. Workshop on Integrated Nonlinear Microwave and Millimetrewave Circuits (INMMIC), Brive la Gaillarde, France, 2018.
  40. E. R. B. S.M. Dilek P. Harati, “E-Band Transceiver System Characterization Based on Bandwidth Dependent Linear Impairments,” in Proc. German Microwave Conference (GeMIC), Freiburg, pp. 1--4, 2018.
  41. G. E. I. Dan B. Schoch, “Considerations on Local Oscillator Isolation in a Terahertz Wireless Link Used for Future Communication Systems,” in Proc. 43rd Int. Conf. on Infrared, Millimeter and Terahertz Waves (IRMMW), Nagoya, 2018.
  42. A. L. C. Grötsch S. Wagner, “Ultra-Broadband Frequency Multiplier MMICs for Communication and Radar Applications,” in Proc. 13th European Microwave Integrated Circuits Conf. EuMIC, Madrid, pp. 1--4, 2018.
  43. I. K. C. Salcines B. Holzinger, “Characterization of intrinsic capacitances of power transistors under high current conduction based on pulsed S-Parameter measurements,” in Proc. 6th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA), Atlanta, 2018.
  44. I. Kallfass, “MMIC-based THz frontends for wireless communication beyond 100 Gbps,” EPSRC THz Communications Meeting, London, 2018.
  45. A. T. D. Mueller F. Boes, “Crosstalk Analysis and Correction in On-Wafer Measurements at WR-3 Band Frequencies,” in Proc. German Microwave Conference (GeMIC), Freiburg, pp. 1--4, 2018.
  46. I. K. C. Grötsch A. Tessmann, “An Active Multiplier-by-Six S-MMIC for 500 GHz,” in Proc. 43rd Int. Conf. on Infrared, Millimeter and Terahertz Waves (IRMMW), Nagoya, pp. 1--4, 2018.
  47. I. K. J. Walter J. Acuna, “Design and Implementation of an Integrated Current Sensor for a Gallium Nitride Half-Bridge,” in. Proc. PCIM Europe, Nuremberg, Germany, 2018.
  48. I. K. P. Harati A. Dyskin, “Analog Carrier Recovery for Broadband Wireless Communication Links,” in Proc. European Microwave Conf. EuMC, Madrid, pp. 1--4, 2018.
  49. I. K. A. Dyskin P. Harati, “An Inductorless E-Band Frequency Divider SiGe HBT MMIC With Split-Resistive Load Technique,” in Proc. 12th European Microwave Integrated Circuits Conf. EuMIC, Nuremberg, pp. 1--4, 2017.
  50. J. Acuna I. Kallfass, “Thermal Optimization of a Half-bridge Power Module based on Chip Scale GaN HEMTs,” in Proc. 19th Conference on Power Electronics and Applications EPE, Warsaw, 2017.
  51. H. K. C. Salcines I. Kallfass, “Full Characterization of High Voltage Power Transistor Intrinsic Capacitances based on a Single 2-Port S-Parameters Measurement,” in Proc. 19th Conference on Power Electronics and Applications EPE, Warsaw, 2017.
  52. I. K. A. Dyskin P. Harati, “Layout and Interconnect Optimization for Low Power and High Sensitivity Operation of E-Band SiGe HBT Frequency Dividers,” IEEE Microwave and Wireless Components Letters, vol. 28, no. 1, Art. no. 1, 2017, doi: 10.1109/LMWC.2017.2772169.
  53. A. Dyskin I. Kallfass, “Analytical Approach of SiGe HBT Static Frequency Divider Design for Millimeter-Wave Frequency Operation,” IEEE Trans. Microwave Theory and Techniques, vol. 66, no. 3, Art. no. 3, 2017, doi: 10.1109/TMTT.2017.2775244.
  54. I. K. C. Grötsch A. Tessmann, “Ultra-Wideband Single-Balanced Quadrature Receiver-MMIC for 240 GHz High Data Rate Communication,” in Proc. 42 International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW), Cancun, pp. 1--4, 2017.
  55. K. S. M. Bastarous C. Salcines, “Static Drain-Source Current Model for First and Third Quadrant Operation for GaN HEMT Power Transistors,” in. Proc. IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL), 2017.
  56. H. M. A. Leuther A. Tessmann, “InGaAs mHEMT Technology for High-Resolution Radar, Imaging and Communication,” in Proc. Compound Semiconductor Week (CSW), Berlin, 2017.
  57. I. D. P. Harati E. Rosello, “E-Band Downlink Wireless Data Transmission for Future Satellite Communication,” in Proc. IEEE Radio and Wireless Symposium, Phoenix, 2017.
  58. A. T. P. Harati B. Schoch, “Is E-Band Satellite Communication Viable?,” IEEE Microwave Magazine, vol. 18, no. 7, Art. no. 7, 2017, doi: 10.1109/MMM.2017.2738898.
  59. I. K. N. Boettcher H. Afewerki, “A Novel Approach for the Optimal Design of Integrated RC Snubbers,” in Proc. Int. Symp. and Exhibition on Electromagnetic Compatibility (EMC Europe), pp. 1--6, 2017.
  60. S. S. E. R. Castillo P. Harati, “Spatial-Frequency-Scanning Data Transmission for mmW Multi-User Wireless Communication Systems,” in Proc. 47th European Microwave Conf. EuMC, Nuremberg, pp. 1--4, 2017.
  61. E. R. I. Dan S. Shiba, “Measurement of Complex Transfer Function of Analog Transmit-Receive Frontends for Terahertz Wireless Communications,” in Proc. 47th European Microwave Conf. EuMC, Nuremberg, pp. 1--4, 2017.
  62. S. S. I. Dan C. M. Groetsch, “Investigation of Local Oscillator Isolation in a 300 GHz Wireless Link,” in Proc. Conf. on Microwaves, Communications, Antennas and Electronic Systems (COMCAS), Tel Aviv, pp. 1--6, 2017.
  63. J. Weimer I. Kallfass, “Multi-Domain Analysis of Power Electronic Modules with Rapid Finite Element Method Simulation,” in Proc. 6th Int. Education Forum on Environment and Energy Science, Tenerife, 2017.
  64. H. K. C. Salcines I. Kallfass, “Full Characterization of High Voltage Power Transistor Intrinsic Capacitances based on a Single 2-Port S-Parameters Measurement,” in Proc. Applied Power Electronics Conf. (APEC), Tampa, 2017.
  65. I. Kallfass, “Compound Semiconductor Based Microwave and Power Electronic Circuits,” Kolloquium "Bauelemente & Technologien, Institut für Halbleitertechnologie, Universität Stuttgart, 2017.
  66. I. K. J. Acuna A. Seidel, “Development and Implementation of a Gallium Nitride based Power Module for Light Electro-mobility Applications,” in Proc. 3rd IEEE Southern Power Electronics Conference (SPEC), Puerto Varas, Chile, 2017.
  67. E. R. I. Dan S. Shiba, “Measurement of Complex Transfer Function of Analog Transmit-Receive Frontends for Terahertz Wireless Communications,” in Proc. IEEE Int. Microwave Symposium, Hawaii, 2017.
  68. Y. L. S. Moench C. Salcines, “Sensitivity Analysis of 600 V Lateral GaN-on-Si HEMTs to Substrate Potential by 4-Terminal IV, CV, Qg Characterization for the Improvement of HEMT Models,” in Proc. IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL), pp. 1--4, 2017.
  69. I. K. T. Kuerner T. Merkle, “Ultrahohe Datenraten bei Terahertz-Frequenzen übertragen,” Presseinformationen Forschung, TU Braunschweig, 2016.
  70. I. Kallfass, “All-Electronic 300 GHz Analog Transmit/Receive Frontends for Multi-Gigabit Indoor Wirleless Communication,” Form Nano to Terahertz Seminar, IEMN, Lille, 2016.
  71. B. W. S. Mönch R. Reiner, “Single-Input GaN Gate Driver based on Depletion-Mode Logic integrated with a 600 V GaN-on-Si Power Transistor,” in Proc. 4th IEEE Workshop on Wide Bandgap Power Devices and Applications, pp. 1--6, 2016.
  72. H. K. C. Salcines I. Kallfass, “Dynamic Characterization of the Input and Reverse Transfer Capacitances in Power MOSFETs under High Current Conduction,” in Proc. Applied Power Electronics Conf. (APEC), Long Beach, 2016.
  73. P. B. D. Schwantuschke R. Henneberger, “GaN-based E-band power amplifier modules,” in Proc. European Microwave Conf., London, 2016.
  74. I. Kallfass, “300 GHz Fixed Wireless Links,” Workshop Millimeter-Wave Technologies for 5G Mobile Networks and Short-Range Communications, 2016.
  75. D. S. P. Harati A. Tessmann, “E-Band Transmitter with 29 dBm RF Power for Satellite Communication,” in Proc. European Microwave Conf., London, 2016.
  76. T. M. S. Rey I. Kallfass, “Input from the TERAPAN Project to the TG3d Call for Contributions to the Response on the Liaison Statement from ITU-R WP1A. IEEE 802.15 TG3d,” Available: https://mentor.ieee.org/802.15/dcn/16/15-16-0082-01-003d-input-from-the-terapan-project-to-the-tg3d-call-for-contributions-to-the-response-on-the-liaison-statementfrom-itu-r-wp1a.docx, 2016.
  77. A. B. S. Moench M. S. Costa, “High Thermal Conductance AlN Power Module with Hybrid Integrated Gate Drivers and SiC Trench MOSFETs for 2 kW Single-Phase PV Inverter,” in Proc. 18th European Conference on Power Electronics and Applications (EPE), Karlsruhe, Germany, 2016.
  78. F. B. T. Messinger K. KrishneGowda, “Multi-Level 20 Gbit/s PSSS Transmission Using a Linearity-Limited 240 GHz Wireless Frontend,” in Proc. Conf. on Microwaves, Communications, Antennas and Electronic Systems (COMCAS), pp. 1--4, 2015.
  79. J. A. U. J. Lewark T. Mahler, “Experimental Validation of Heavy Rain Attenuation in E-Band Based on Climate Wind Tunnel Measurements at 77 GHz,” CEAS Space Journal, vol. 7, no. 4, Art. no. 4, 2015.
  80. K. I., “240GHz wireless communication system operating at up to 100 Gbps,” in Proc. IEEE MTT-S Int. Microwave Symp., Phoenix, Workshop Terahertz-wave wireless communications, 2015.
  81. S. R. I. Kallfass I. Dan, “Towards MMIC-Based 300 GHz Indoor Wireless Communication Systems,” Trans. Institute of Electronics, Information and Communication Engineers IEICE, vol. E98-C, no. 12, Art. no. 12, 2015.
  82. I. Kallfass, “How to Design Power Electronics - The HF in Power Semiconductor Modeling and Design,” Innovations in EDA Webcast Series, Keysight Technologies, 2015.
  83. A. B. S. Mönch M. Costa, “Monolithic Integrated Quasi-Normally-Off Gate Driver and 600 V GaN-on-Si HEMT,” in Proc. 3rd IEEE Workshop on Wide Bandgap Power Devices and Applications, pp. 1--6, 2015.
  84. T. M. F. Boes J. Antes, “Multi-Gigabit E-band Wireless Data Transmission,” in Proc. IEEE MTT-S Int. Microwave Symp., Phoenix, pp. 1--4, 2015, doi: 10.1109/MWSYM.2015.7166930.
  85. K. KrishneGowda, T. Messinger, A. Wolf , J. Scheytt, I. Kallfass, R. Kraemer, “Towards 100 Gbps Wireless Communication in THz Band with PSSS Modulation: A Promising Hardware in the Loop Experiment,” in Proc. 15th IEEE Int. Conf. on Ubiquitous Wireless Broadband, pp. 1--4, 2015.
  86. A. L. D. Mueller A. Tessmann, “A H-Band Vector Modulator MMIC for Phase-Shifting Applications,” in Proc. IEEE MTT-S Int. Microwave Symp., Phoenix, 2015.
  87. S. R. D. Mueller S. Diebold, “D-Band Digital Phase Shifters for Phased-Array Applications,” in Proc. German Microwave Conference (GeMIC), Erlangen, 2015.
  88. H. M. S. Diebold S. Wagner, “A Novel 1x4 Coupler for Compact and High-Gain Power Amplifier MMICs around 250 GHz,” Microwave Theory and Techniques, IEEE Transactions on, vol. 63, no. 3, Art. no. 3, 2015, doi: 10.1109/TMTT.2015.2396492.
  89. I. Kallfass, “MMIC-based wireless communication frontends operating at up to 100 Gbps,” Workshop 100 Gbit/s Wireless Communications at High mm-Wave Frequencies, European Microwave Conf., 2015.
  90. F. B. D. Meier J. Antes, “Reliability of an E-Band Wireless Link for Tranmission Distances up to 15.7 km,” in Proc. German Microwave Conference (GeMIC), Erlangen, 2015.
  91. J. A. T. Messinger D. Mueller, “Divide-by-8 Phase Detector MMIC for PLL-based Carrier Recovery in E-Band Communication,” in Proc. German Microwave Conference (GeMIC), Erlangen, pp. 237--240, 2015.
  92. F. B. J. Antes D. Meier, “Experimental validation of E- band wireless transmission at 15 Gbit/s for distances up to 15.7km using a broadband MMIC-based frontend,” submitted, IEEE Trans. on Microwave Theory and Techniques, 2015.
  93. S. W. T. Messinger J. Antes, “Wideband 200 GHz Injection-Locked Frequency Divide-by-Two MMIC in GaAs mHEMT Technology,” in Proc. IEEE Mediterranean Microwave Symposium, Lecce, pp. 1--4, 2015.
  94. R. W. I. Kallfass G. Eren, “High Linearity Active GaN-HEMT Down-Converter MMIC for E-Band Radar Applications,” in Proc. European Microwave Integrated Circuit Conf., Rome, pp. 1--4, 2014.
  95. S. K. T. Merkle A. Leuther, “Backside Process Free Broadband Amplifier MMICs at D-Band and H-Band in 20 nm mHEMT Technology,” in Proc. IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), La Jolla, pp. 1--3, 2014.
  96. A. H. S. Diebold J. Kühn, “Comparison of Two 325 GHz LNAs using mHEMT with 35 nm Gate-Length in Common-Source and Cascode configuration,” in Proc. Asia Pacific Microwave Conf., pp. 1--3, 2014.
  97. D. L.-D. S. Koenig J. Antes, “20 Gbit/s Wireless Bridge at 220 GHz Connecting Two Fiber-Optic Links,” Optical Communications and Networking, IEEE/OSA Journal of, vol. 6, no. 1, Art. no. 1, 2014.
  98. D. L.-D. W. Freude S. Koenig, “Wireless Communications on THz Carriers Takes Shape,” in Proc. 16th Int. Conf. on Transparent Optical Networks, Graz, pp. 1--4, 2014.
  99. A. T. J. Antes U. Lewark, “Ultra-Wideband Single-Balanced Transmitter-MMIC for Future 300 GHz Communication Systems,” in Proc. IEEE Int. Microwave Symposium, Tampa, pp. 1--3, 2014.
  100. J. A. F. Boes T. Messinger, “Ultra-Broadband MMIC-Based Wireless Link at 240 GHz Enabled by 64 GS/s DAC,” in Proc. 39th Int. Conf. on Infrared, Millimeter, and Terahertz Waves (IRMMW), Tuscon AZ, pp. 1--4, 2014.
  101. A. T. U. J. Lewark H. Theveneau, “Active 600GHz Frequency Multiplier-by-Six S-MMICs for Submillimeter-Wave Generation,” in Proc. IEEE Int. Microwave Symposium, Tampa, 2014.
  102. U. J. Lewark et al., “A Miniaturized Unit Cell for Ultra-Broadband Active Millimeter-Wave Frequency Multiplication,” Microwave Theory and Techniques, IEEE Transactions on, vol. 62, no. 6, Art. no. 6, 2014, doi: 10.1109/TMTT.2014.2318272.
  103. F. B. U.J. Lewark J. Antes, “Rain Attenuation Prediction Based on Climate Wind Tunnel Measurements at 77GHz,” IEEE Trans. Microwave Theory and Techniques, 2014.
  104. I. K. K.P. Pahl A. Leuther, “Design and Evaluation of Realizable and Compact Low-Impedance Transmission Lines for Two Top Metal Layer Semiconductor Processes,” in Proc. IEEE Int. Microwave Symposium, Tampa, pp. 1--3, 2014.
  105. S. K. P. Pahl S. Diebold, “Design and Evaluation of Realizable and Compact Low-Impedance Transmission Lines for Two Top Metal Layer Semiconductor Processes,” in Proc. Asia Pacific Microwave Conf., pp. 1--3, 2014.
  106. F. B. D. Lopez-Diaz A. Tessmann, “Multi-Gigabit Data Transmission at 240 GHz with Complex Baseband Power Detection,” in Proc. European Microwave Integrated Circuit Conf., Rome, pp. 1--4, 2014.
  107. D. M. J. Antes F. Boes, “MMIC-based E-Band Frontend for Multi-Gigabit Wireless Links,” in Proc. Radio Wireless Week (RWW), pp. 1--3, 2014.
  108. D. R. Aleksey Dyskin Sandrine Wagner, “An Active 60-90 GHz Single Pole Double Throw Switch MMIC,” Journal of Infrared, Millimeter, and Terahertz Waves, vol. 35, no. 3, Art. no. 3, 2013.
  109. I. Kallfass, “Prospects and Challenges of Modern Semiconductor Technologies in Power Electronic Applications,” 36. Sitzung des gemeinsamen Leitungsgremiums Rechnergestützter Schaltungs- und Systementwurf (RSS-LG) Fachaussschuß3.5 GI Fachbereich 8 GMM Fachausschuß8.2 ITG, 2013.
  110. S. W. D. Lopez-Diaz A. Tessmann, “A 240 GHz Quadrature Receiver and Transmitter for Data Transmission up to 40 Gbit/s,” in Proc. European Microwave Week, Nuremberg, pp. 1--4, 2013.
  111. A. L. A. Huelsmann A. Tessmann, “Metamorphic HEMT Based Modules for the LO-Generation of Sub-Millimeter-Wave Space Sensors,” in Proc. 6th International Conference on Recent Advances in Space Technologies (RAST), 2013.
  112. I. Kallfass, “Point-to-Point Communication at 240 GHz with up to 40 Gbit/s Data Rate,” Workshop THz Systems and Components in Communications, Sensing and Imaging, European Microwave Conf., 2013.
  113. D. S. S. Diebold D. Müller, “AlGaN/GaN-based HEMT Variable Gain Amplifiers for W-Band Operation,” in Proc. IEEE Int. Microwave Symp., Seattle, pp. 1--4, 2013.
  114. J. W. U.J. Lewark J. Antes, “Link budget analysis for future E-band gigabit satellite communication links (71-76 and 81-84 Ghz),” CEAS Space Journal, pp. 1--6, 2013.
  115. K. I., “Prospects and Challenges of Modern Semiconductor Technologies in Power Electronic Applications,” in Proc. Microwave Integrated Circuits and Systems, Workshop on RF, analog, millimeterwave integrated circuits and systems, Israel Institute of Technology, Haifa, Israel, 2013.
  116. I. Kallfass, “Multi-Gigabit Transmission Based on All-active 200-280 GHz MMIC Chip Set,” IEEE Radio Wireless Week Symposium, Austin, TX, 2013.
  117. O. A. E. Weissbrodt M. Schlechtweg, “W-Band Active Loads and Switching Front End MMICs for Radiometer Calibration,” Int. Journal of Microwave and Wireless Technologies, vol. 5, pp. 293--299, 2013.
  118. S. W. S. Diebold P. Pahl, “A Broadband Amplifier MMIC with 105 to 140 GHz bandwidth,” in Proc. Asia Pacific Microwave Conf., Seoul, pp. 1--4, 2013.
  119. U. L. I. Kallfass J. Antes, “MHEMT-Based MMIC Frontends for THz Radar and Communication,” in Proc. Workshop Signal Generation, Amplification, Detection and System Implementation at THz Frequencies, Int. Microwave Symp. IMS and RFIC, Seattle, 2013.
  120. D. R. A. Dyskin S. Wagner, “Performance Comparison for Millimeter-Wave Single-Pole Double Throw Switches,” in Proc. IEEE Int. Conf. on Microwaves, Communications, Antennas and Electronic Systems (COMCAS), pp. 1--5, 2013.
  121. A. T. U. J. Lewark H. Theveneau, “A 440 GHz Balanced Active Frequency Multiplier-by-Four SMMIC,” in Proc. European Microwave Week, Nuremberg, pp. 1--4, 2013.
  122. A. L. T. Merkle S. Koch, “Compact 110-170 GHz Amplifier in 50 nm mHEMT Technology with 25 dB Gain,” in Proc. European Microwave Week, Nuremberg, pp. 1--4, 2013.
  123. D. L.-D. S. Koenig F. Boes, “100 Gbit/s Wireless Link with mm-Wave Photonics,” in Proc. OFC, Anaheim, 2013.
  124. K. I., “Active Integrated Circuits in Millimeter-Wave Applications,” in Proc. Microwave Integrated Circuits and Systems, Workshop on RF, analog, millimeterwave integrated circuits and systems, Israel Institute of Technology, Haifa, Israel, 2013.
  125. I. K. B. Baldischweiler D. Bruch, “Characterization of a DC to 40 GHz SPDT switch based on GaAs mHEMT technology at cryogenic temperature,” in Proc. European Microwave Week, Nuremberg, pp. 1--4, 2013.
  126. U. J. Lewark I. Kallfass, “Miniaturized Broadband G-Band Frequency-Doubler MMIC,” in Proc. European Microwave Integrated Circuits Conf., Amsterdam, pp. 1--4, 2012.
  127. S. S. S. Ayhan S. Diebold, “A 96 GHz Radar System for Respiration and Heart Rate Measurements,” in Proc. IEEE MTT-S Int. Microwave Symposium, Montreal, 2012.
  128. D. L.-D. I. Kallfass J. Antes, “Broadband Active Integrated Circuits for Terahertz Communication,” invited, in Proc. 18th European Wireless Conference, Poznan, pp. 1--5, 2012.
  129. M. S. E. Weissbrodt A. Tessmann, “Active Load Modules for W-Band Radiometer Calibration,” in Proc. IEEE Geoscience and Remote Sensing Society (IGARSS) Symposium, Munich, pp. 1--4, 2012.
  130. R. Q. D. Schwantuschke P. Brückner, “A 40 to 60 GHz Broadband High-power Amplifier MMIC in 100 nm AlGaN/GaN HEMT Technology,” in Proc. European Microwave Conf., Amsterdam, pp. 1--4, 2012.
  131. S. W. U. J. Lewark A. Tessmann, “255 to 330 GHz Active Frequency-Tripler MMIC,” in Proc. International Workshop on Integrated Nonlinear Microwave and Millimetre-wave Circuits (INMMiC), Dublin, pp. 1--4, 2012.
  132. T. Z. J. Antes T. Mahler, “Study on data transmission of complex modulated signals using an MMIC-based 220GHz wireless link,” in Proc. International Symposium on Signals, Systems and Electronics, Potsdam, pp. 1--4, 2012.
  133. D. L.-D. S. Koenig J. Antes, “High-Speed Wireless Bridge at 220 GHz Connecting Two Fiber-Optic Links Each Spanning up to 20 km,” in Proc. Optical Fiber Communication Conference (OFC), 2012.
  134. H. M. D. Mueller S. Diebold, “A D-Band Phase Compensated Variable Gain Amplifier,” in Proc. International Workshop on Integrated Nonlinear Microwave and Millimetre-wave Circuits (INMMiC), Dublin, pp. 1--4, 2012.
  135. S. W. C. Zech S. Diebold, “An Ultra-Broadband Low-Noise Traveling-Wave Amplifier Based on 50nm InGaAs mHEMT Technology,” in Proc. 7th German Microwave Conference, Ilmenau, pp. 1--4, 2012.
  136. H. M. J. Laengst S. Diebold, “A Balanced 175-240 GHz Amplifier MMIC using Airbridge Transmission Lines,” in Proc. International Workshop on Integrated Nonlinear Microwave and Millimetre-wave Circuits (INMMiC), Dublin, pp. 1--4, 2012.
  137. A. T. D. Lopez-Diaz I. Kallfass, “A Subharmonic Chipset for Gigabit Communication around 240 GHz,” in Proc. IEEE MTT-S Int. Microwave Symposium, Montreal, 2012.
  138. M. S. E. Weissbrodt A. Leuther, “Highly Integrated Switching Calibration Front-End MMIC with Active Loads for W-Band Radiometers,” in Proc. European Microwave Conf., Amsterdam, pp. 1--4, 2012.
  139. U. J. L. J. Antes D. Lopez-Diaz, “A high linearity I/Q Mixer for High Data Rate E-Band Wireless Communication Links,” in Proc. European Microwave Conf., Amsterdam, pp. 1--4, 2012.
  140. I. K. A. Dyskin D. Ritter, “Ultra Wideband Cascaded Low Noise Amplifier Implemented in 100-nm GaAs Metamorphic-HEMT Technology,” in Proc. International Symposium on Signals, Systems and Electronics, Potsdam, pp. 1--4, 2012.
  141. A. L. J. Antes S. Koenig, “220 GHz wireless data transmission experiments up to 30 Gbit/s,” in Proc. IEEE MTT-S Int. Microwave Symposium, Montreal, 2012.
  142. A. T. I. Kallfass H. Massler, “FET-Based Frequency Multiplier S-MMICs up to 440 GHz,” in proc. Progress In Electromagnetics Research Symposium PIERS, Marrakesh, 2011.
  143. A. T. A. Leuther S. Koch, “20 nm metamorphic HEMT with 660 GHz ft,” in Proc. Int. Conf. on Indium Phosphide and Related Materials (IPRM), Berlin, 2011.
  144. R. K. D. Schwantusche C. Haupt, “A 56-65 GHz High-power Amplifier MMIC using 100 nm AlGaN/GaN Dual-gate HEMTs,” in Proc. European Micrwoave Integrated Circuit Conf., Manchester, pp. 1217--1220, 2011.
  145. R. S. S. Stanko W. Johannes, “SAR with MIRANDA Millimeterwave Radar using Analog and New Digital Approach,” in proc. 8th European Radar Conference (EuRAD), pp. 214--217, 2011.
  146. S. W. I. Kallfass H. Massler, “A Highly Linear 84 GHz Low Noise Amplifier MMIC in AlGaN/GaN HEMT Technology,” in proc. IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies, Barcelona, 2011.
  147. T. S. I. Kallfass J. Antes, “All Active MMIC Based Wireless Communication at 220 GHz,” IEEE Trans. on Terahertz Science and Technology, vol. 1, no. 2, Art. no. 2, 2011.
  148. I. Kallfass, “Submillimetre MMIC design in state of the art MHEMT technology,” in workhop Proc. Advanced III-V MMIC Design Techniques, European Microwave Conf., Manchester, 2011.
  149. H. M. U. J. Lewark A. Tessmann, “A 300 GHz Active Frequency-Tripler MMIC,” in Proc. 6th European Microwave Integrated Circuit Conference, Manchester, pp. 236--239, 2011.
  150. A. T. I. Kallfass A. Huelsmann, “W-Band Direct Detection Radiometers using Metamorphic HEMT Technology,” in Proc. SPIE Symposium on Optics/Photonics, Orlando, 2011.
  151. M. A. V. Vassilev N. Wadefalk, “Integrated Front-ends up to 200 GHz,” in Proc. IEEE International Microwave Workshop Series on Millimeter Wave Integration Technologies, 2011.
  152. U. Lewark, A. Tessmann, H. Massler, A. Leuther, and I. Kallfass, “Active frequency multiplier-by-nine \MMIC\ for millimeter-wave signal generation,” in Proc. German Microwave Conference (GeMIC), Darmstadt, pp. 1--4, 2011.
  153. J. A. I. Kallfass A. Tessmann, “Wireless DVB-C Transmission at 220 GHz Using Active Single-Chip Receive and Transmit MMICs,” in Proc. IEEE Int. Microwave Symposium, Baltimore, 2011.
  154. R. E. M. S. Kraus I. Kallfass, “A 20-GHz Bipolar Latched Comparator with Improved Sensitivity Implemented in InP HBT Technology,” IEEE Trans. on Microwave Theory and Techniques, vol. 59, no. 3, Art. no. 3, 2011.
  155. H. M. I. Kallfass A. Tessmann, “Balanced Active Frequency Multipliers for W-Band Signal Sources,” in Proc. 6th European Microwave Integrated Circuit Conference, Manchester, pp. 101--104, 2011.
  156. A. H. E. Weissbrodt I. Kallfass, “W-Band Radiometer System with Switching Front-End for Multi-Load Calibration,” in Proc.IEEE Int. Geoscience and Remote Sensing Symposium, 2011.
  157. A. T. J. Antes D. Lopez-Diaz, “MMIC based wireless data transmission of a 12.5 Gbit/s signal using a 220 GHz carrier,” in Proc. European Micrwoave Integrated Circuit Conf., Manchester, pp. 238--241, 2011.
  158. U. J. Lewark, A. Tessmann, H. Massler, A. Leuther, and I. Kallfass, “Active single ended frequency multiplier-by-nine \MMIC\ for millimeter-wave imaging applications,” in Proc. Workshop on Integrated Nonlinear Microwave and Millimetre-Wave Circuits (INMMIC), pp. 1--4, 2011, doi: 10.1109/INMMIC.2011.5773324.
  159. I. K. M. Schlechtweg A. Tessmann, “Millimeter-Wave Circuits and Modules up to 500 GHz Based on Metamorphic HEMT Technology for Remote Sensing and Wireless Communication Applications,” in Proc. 9th IEEE International NEWCAS Conference, Bordeaux, 2011.
  160. N. W. M. Abbasi S. E. Gunnarsson, “Single-Chip 220 GHz Active Heterodyne Receiver and Transmitter MMICs with On-Chip Integrated Antenna,” IEEE Trans. Microwave Theory and Techniques, vol. 59, no. 2, Art. no. 2, 2011.
  161. S. Diebold et al., “Design and model studies for solid-state power amplification at 210 GHz,” Int. Journal of Microwave and Wireless Technologies, vol. 3, no. Special Issue 03, Art. no. Special Issue 03, 2011, doi: 10.1017/S1759078711000432.
  162. I. Kallfass, “Berührungslose Bestimmung von Lebenszeichen mit Hilfe von Millimeterwellen-Radar,” VDE-ITG-Fachausschuss 7.2: Funksysteme Funk und Leben: Medizintechnik, Ambient Assisted Living, Karlsruhe, 2011.
  163. U. L. A. Tessmann H. Massler, “Fully Integrated 300 GHz Receiver S-MMICs in 50 nm Metamorphic HEMT Technology,” in Proc. IEEE Compound Semiconductor IC Symposium (CSICS), Hawaii, 2011.
  164. I. K. S. Kraus R. E. Makon, “Sensitivity of a 20-GS/s InP DHBT Latched Comparator,” in Proc. 22nd International Conf. on Indium Phosphide and Related Materials, 2010.
  165. A. T. D. Lopez-Diaz I. Kallfass, “A Balanced Resistive 210 GHz Mixer with 50 GHz IF Bandwidth,” in Proc. 5th European Microwave Integrated Circuit Conf., Paris, pp. 190--193, 2010.
  166. S. Wuensch , D. Bruch , E.Crocoll , I. Kallfass and M. Siegel, “Development of Monolithic Microwave Integrated Amplifiers as Readout for Detectors at 4.2 K,” in Proc. Applied Superconductivity Conference, Washington D.C., 2010.
  167. H. M. I. Kallfass A. Tessmann, “A W-Band Active Frequency-Multiplier-by-Six in Waveguide Package,” in Proc. German Microwave Conf., Berlin, pp. 53--56, 2010.
  168. S. D. I. Kallfass D. Lopez-Diaz, “Active MMIC Technology for 240 GHz Wireless Data Links,” IEEE P802.15 Working Group for Wireless Personal Area Networks, Dallas, available at https://mentor.ieee.org/802.15/documents, 2010.
  169. S. Koch, M. Guthoerl, I. Kallfass, A. Leuther, and S. Saito, “A 120-145 GHz Heterodyne Receiver Chipset Utilizing the 140 GHz Atmospheric Window for Passive Millimeter-Wave Imaging Applications,” Solid-State Circuits, IEEE Journal of, vol. 45, no. 10, Art. no. 10, 2010, doi: 10.1109/JSSC.2010.2057830.
  170. A. T. D. Lopez-Diaz I. Kallfass, “Monolithic Integrated 210 GHz Couplers for Balanced Mixers and Image Rejection Mixers,” in Proc. International Wokshop on Integrated Nonlinear Microwave and Millimetre-wave Circuits, Goeteborg, Sweden, pp. 58--61, 2010.
  171. R. K. V. Vassilev N. Wadefalk, “MMIC-based Components for MM-wave Instrumentation,” IEEE Microwave and Wireless Components Letters, vol. 20, no. 10, Art. no. 10, 2010.
  172. R. K. V. Vassilev N. Wadefalk, “MMIC-based Receiver Components for MM-wave Radiometry,” in Proc. 35th International Conference on Infrared, Millimeter and THz Waves, Rome, Italy, 2010.
  173. A. T. I. Kallfass H. Massler, “A W-Band Four-to-One Switch MMIC with Integrated Reference Channel in Waveguide Package,” rejected, IEEE Microwave and Guided Wave Letters, 2010.
  174. A. H. I. Kallfass A. Tessmann, “MMIC Technology for Spectroscopy Applications,” in Proc. SPIE Millimetre Wave and Terahertz Sensors and Technology III, vol. 7837, pp. 1--11, 2010.
  175. H. M. I. Kallfass A. Tessmann, “A 300 GHz Active Frequency-Doubler And Integrated Resistive Mixer MMIC,” in Proc. 4th European Microwave Integrated Circuit Conference, Rome, pp. 200--203, 2009.
  176. H. M. I. Kallfass P. Pahl, “A 144 GHz Power Amplifier MMIC With 11 dBm Output Power, 10 dB Associated Gain and 10 \% Power-Added Efficiency,” in Proc. IEEE MTT-S International Microwave Symposium, Boston, pp. 429--432, 2009.
  177. C. K. M. Abbasi R. Kozhuharov, “Single-Chip Frequency Multiplier Chains for Millimeter-Wave Signal Generation,” IEEE Trans. Microwave Theory and Techniques, vol. 57, no. 12, Art. no. 12, 2009.
  178. I. K. A. Leuther A. Tessmann, “Metamorphic HEMT Technology for Low-noise Applications,” in Proc. 20th Int. Conf. on Indium Phosphide and Related Materials, 2009.
  179. H. M. I. Kallfass A. Tessmann, “A 200 GHz Active Heterodyne Receiver MMIC With Low Sub-Harmonic LO Power Requirements for Imaging Frontends,” in Proc. 4th European Microwave Integrated Circuit Conference, Rome, pp. 45--48, 2009.
  180. A. L. I. Kallfass A. Tessmann, “The Metamorphic HEMT and Its Applications in Remote Sensing,” in Proc. 5th ESA Workshop on Millimetre Wave Technology and Applications & 31st ESA Antenna Workshop, ESTEC, Noordwijk, 2009.
  181. I. K. S. Koch M. Guthoerl, “A 140 GHz Heterodyne Receiver Chipset for Passive Millimeter Wave Imaging Applications,” in Proc. IEEE Compound Semiconductor Integrated Circuit Symposium CSICS, 2009.
  182. H. Zirath, N. Wadefalk, R. Kuzhuharov , S. E. Gunnarsson, S. Cherednichenko, I. Angelov, M. Abbasi, B. Hansson, V. Vassilev, J. Svedin, S. Rudner, I. Kallfass, A. Leuther, “Integrated receivers up to 220 GHz utilizing GaAsmHEMT technology,” in Proc. IEEE International Symposium on Radio-Frequency Integration Technology, Singapore, 2009.
  183. J. S. S. E. Gunnarsson N. Wadefalk, “A 220 GHz Single-Chip Receiver MMIC with Integrated Antenna,” IEEE Microwave and Wireless Component Letters, vol. 18, no. 4, Art. no. 4, 2008.
  184. A. L. A. Tessmann I. Kallfass, “Metamorphic HEMT MMICs and Modules for Use in a High-Bandwidth 210 GHz Radar,” IEEE J. Solid-State Circuits, vol. 43, no. 10, Art. no. 10, 2008.
  185. A. Tessmann, I. Kallfass, A. Leuther, H. Massler, M. Schlechtweg, and O. Ambacher, “Metamorphic MMICs for Operation Beyond 200 GHz,” in Proc. European Microwave Integrated Circuit Conference, 2008. EuMIC 2008., pp. 210--213, 2008, doi: 10.1109/EMICC.2008.4772266.
  186. A. L. I. Kallfass H. Massler, “A 210 GHz Dual-Gate FET Mixer MMIC with \textgreater2 dB Conversion Gain, High LO-to-RF Isolation, and Low LO-Drive Requirements,” IEEE Microwave and Wireless Components Letters, vol. 18, no. 8, Art. no. 8, 2008.
  187. A. L. S. Koch I. Kallfass, “A Four-Antenna Transceiver MIMIC for 60 GHz Wireless Multimedia Applications,” in Proc. 38th European Microwave Conference, Amsterdam, pp. 1529--1532, 2008.
  188. M. A. S.E. Gunnarsson N. Wadefalk, “MMIC design at G-band (140-220 GHz) including a 220 GHz Single-Chip Receiver MMIC with Integrated Antenna,” in Proc. GHz Symposium, Goeteborg, 2008.
  189. A. T. I. Kallfass H. Massler, “A Broadband Frequency Sixtupler MIMIC for the W-Band with \textgreater7 dBm Output Power and \textgreater6 dB Conversion Gain,” in Proc. IEEE MTT-S Int. Microwave Symp., Honolulu, Hawai, pp. 2169--2172, 2007.
  190. R. W. S. Koch I. Kallfass, “An Analogue, 4:2 MUX/DEMUX Front-End MIMIC for Wireless 60 GHz Multiple Antenna Transceivers,” in Proc. IEEE MTT-S Int. Microwave Symp., Honolulu, Hawai, pp. 1121--1124, 2007.
  191. I. Kallfass, “Metamorphic and Power RF Transistors and MMICs,” in workshop proceedings European Gallium Arsenide and Other Compound Semiconductors Application Symposium, Manchester, 2006.
  192. T. J. B. I. Kallfass H. Schumacher, “Multiple Time Constant Modeling of Dispersion Dynamics in Hetero Field-Effect Transistors,” IEEE Trans. on Microwave Theory and Techniques, vol. 54, no. 6, Art. no. 6, 2006.
  193. T. P. I. Kallfass H. Schumacher, “One single travelling-wave MMIC for highly linear broadband mixers and variable gain amplifiers,” in Proc. IEEE MTT-S Int. Microwave Symposium, Long Beach, 2005.
  194. H. S. I. Kallfass C. Schick, “A Universal Large-Signal Model for Hetero Field-Effect Transistors,” in Proc. 12th GaAs Symposium, European Microwave Week, Amsterdam, pp. 55--58, 2004.
  195. B. O. I. Kallfass T. J. Brazil, “Large Signal Modelling including Low-Frequency Dispersion of N-channel SiGe MODFETs and MMIC Applications,” Solid-State Electronics, vol. 48, no. 8, Art. no. 8, 2004.
  196. W. E. A. Kubovic A. Denisenko, “Electronic surface barrier characteristics of H-terminated and surface conductive diamond,” Diamond and Related Materials, vol. 13, no. 4, Art. no. 4, 2004.
  197. R. S. V. D. Juncu I. Kallfass, “Behaviour of Logic Gates fabricated on Si/SiGe MODFET Technology,” Electronics Letters, vol. 40, no. 12, Art. no. 12, 2004.
  198. A. A. M. Kasu M. Kubovic, “Microwave performance of diamond MESFET,” Japan Society of Applied Physics, vol. 73, no. 3, Art. no. 3, 2004.
  199. I. K. P. Abele M. Zeuner, “32$\backslash$,GHz MMIC distributed amplifier based on N-channel SiGe MODFETs,” Electronics Letters, vol. 39, no. 20, Art. no. 20, 2003.
  200. R. O. A. Pascht I. Kallfass, “Variable Gain SiGe HBT Amplifier with Low Noise Figure,” 8th IEEE International Symposium on Electron Devices for Microwave and Optoelectronic Applications (EDMO), Glasgow, Scotland, 2000.
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